通用
| 制造商 | Microchip Technology |
|---|---|
| 安装类型 | Surface Mount |
| Product Status | Active |
| Reverse Recovery Time (trr) | 3 µs |
| 技术 | Standard |

来自已导入产品 Attributes 的结构化电气、机械和环境参数。
| 制造商 | Microchip Technology |
|---|---|
| 安装类型 | Surface Mount |
| Product Status | Active |
| Reverse Recovery Time (trr) | 3 µs |
| 技术 | Standard |
| Voltage - Forward (Vf) (Max) @ If | 1 V @ 200 mA |
|---|---|
| Current - Average Rectified (Io) | 4A |
| Current - Reverse Leakage @ Vr | 1 nA @ 125 V |
| 速度 | Standard Recovery >500ns, > 200mA (Io) |
| 封装 | Tape & Reel (TR) |
|---|---|
| Package / Case | SQ-MELF, B |
| 供应商器件封装 | B, SQ-MELF |
| Operating Temperature - Junction | -65°C ~ 150°C |
|---|