通用
| 基础料号 | GD60 |
|---|---|
| Capacitance @ Vr, F | 4577pF @ 1V, 1MHz |
| 制造商 | GeneSiC Semiconductor |
| 安装类型 | Through Hole |
| Product Status | Active |
| 系列 | SiC Schottky MPS™ |
| 技术 | SiC (Silicon Carbide) Schottky |

来自已导入产品 Attributes 的结构化电气、机械和环境参数。
| 基础料号 | GD60 |
|---|---|
| Capacitance @ Vr, F | 4577pF @ 1V, 1MHz |
| 制造商 | GeneSiC Semiconductor |
| 安装类型 | Through Hole |
| Product Status | Active |
| 系列 | SiC Schottky MPS™ |
| 技术 | SiC (Silicon Carbide) Schottky |
| Voltage - DC Reverse (Vr) (Max) | 1700 V |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 1.8 V @ 60 A |
| Current - Average Rectified (Io) | 122A |
| Current - Reverse Leakage @ Vr | 40 µA @ 1700 V |
| 速度 | Fast Recovery =< 500ns, > 200mA (Io) |
| 封装 | Tube |
|---|---|
| Package / Case | TO-247-2 |
| 供应商器件封装 | TO-247-2 |
| Operating Temperature - Junction | -55°C ~ 175°C |
|---|