Allgemein
| Hersteller | STMicroelectronics |
|---|---|
| Montageart | Surface Mount |
| Product Status | Active |
| Serie | ECOPACK®2 |
| Technologie | Schottky |

Strukturierte elektrische, mechanische und umweltbezogene Parameter aus importierten Produktattributen.
| Hersteller | STMicroelectronics |
|---|---|
| Montageart | Surface Mount |
| Product Status | Active |
| Serie | ECOPACK®2 |
| Technologie | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 100 V |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 820 mV @ 5 A |
| Current - Average Rectified (Io) | 5A |
| Current - Reverse Leakage @ Vr | 2.5 µA @ 100 V |
| Geschwindigkeit | Fast Recovery =< 500ns, > 200mA (Io) |
| Gehäuse | Tape & Reel (TR) Cut Tape (CT) |
|---|---|
| Package / Case | TO-277, 3-PowerDFN |
| Hersteller-Gehäuse | TO-277A (SMPC) |
| Grade | Automotive |
|---|---|
| Operating Temperature - Junction | -40°C ~ 175°C |
| Qualification | AEC-Q101 |