Allgemein
| Co-Processors/DSP | Multimedia |
|---|---|
| Ethernet | 2.5Gbps (3) |
| Graphics Acceleration | No |
| Hersteller | NXP USA Inc. |
| Montageart | Surface Mount |
| Product Status | Active |
| Security Features | ARM TZ, Boot Security, TRNG |
| Serie | S32G3 |
| USB | USB 2.0 OTG (1) |

Strukturierte elektrische, mechanische und umweltbezogene Parameter aus importierten Produktattributen.
| Co-Processors/DSP | Multimedia |
|---|---|
| Ethernet | 2.5Gbps (3) |
| Graphics Acceleration | No |
| Hersteller | NXP USA Inc. |
| Montageart | Surface Mount |
| Product Status | Active |
| Security Features | ARM TZ, Boot Security, TRNG |
| Serie | S32G3 |
| USB | USB 2.0 OTG (1) |
| Kernprozessor | ARM® Cortex®-A53, ARM® Cortex®-M7 |
|---|---|
| Geschwindigkeit | 400MHz, 1GHz |
| RAM Controllers | DDR3L SDRAM, LPDDR4 DRAM |
| Voltage - I/O | 1.8V, 3.3V |
| Number of Cores/Bus Width | 3 Core, 64-Bit/8 Core, 32-Bit |
| Gehäuse | Tray |
|---|---|
| Package / Case | 525-FBGA, FCBGA |
| Hersteller-Gehäuse | 525-FCPBGA (19x19) |
| Betriebstemperatur | -40°C ~ 105°C (TA) |
|---|