Allgemein
| Hersteller | Microchip Technology |
|---|---|
| Montageart | Surface Mount |
| Product Status | Active |
| Reverse Recovery Time (trr) | 2 µs |
| Technologie | Standard |

Strukturierte elektrische, mechanische und umweltbezogene Parameter aus importierten Produktattributen.
| Hersteller | Microchip Technology |
|---|---|
| Montageart | Surface Mount |
| Product Status | Active |
| Reverse Recovery Time (trr) | 2 µs |
| Technologie | Standard |
| Voltage - DC Reverse (Vr) (Max) | 400 V |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 1.2 V @ 9 A |
| Current - Average Rectified (Io) | 3A |
| Current - Reverse Leakage @ Vr | 1 µA @ 400 V |
| Geschwindigkeit | Standard Recovery >500ns, > 200mA (Io) |
| Gehäuse | Bulk |
|---|---|
| Package / Case | SQ-MELF, B |
| Hersteller-Gehäuse | B, SQ-MELF |
| Operating Temperature - Junction | -65°C ~ 175°C |
|---|