Honeywell Sensing and Productivity Solutions
ABP2, LEADLESS SMT PACKAGE, SING
Strukturierte elektrische, mechanische und umweltbezogene Parameter aus importierten Produktattributen.
| Output | 14 b |
|---|---|
| Ausgangstyp | I²C |
| Accuracy | ±0.25% |
| Basis-Teilenummer | ABP2LSNT060 |
| Merkmale | Amplified Output, Temperature Compensated |
| Maximum Pressure | 250PSI (1723.69kPa) |
| Hersteller | Honeywell Sensing and Productivity Solutions |
| Montageart | Surface Mount |
| Operating Pressure | 0 ~ 60PSI (0 ~ 413.69kPa) |
| Port Style | Barbless |
| Pressure Type | Vented Gauge |
| Product Status | Active |
| Serie | ABP2 |
| Versorgungsspannung | 1.8V ~ 3.6V |
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| Gehäuse | Box |
|---|---|
| Package / Case | 6-SMD Module, No Lead |
| Port Size | Male - 0.11" (2.74mm) Tube |
| Hersteller-Gehäuse | 6-SMD |
| Termination Style | SMD (SMT) Tab |
| Betriebstemperatur | -40°C~110°C |
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