Allgemein
| Capacitance @ Vr, F | 30pF @ 4V, 1MHz |
|---|---|
| Hersteller | EIC SEMICONDUCTOR INC. |
| Montageart | Through Hole |
| Product Status | Active |
| Technologie | Standard |

Strukturierte elektrische, mechanische und umweltbezogene Parameter aus importierten Produktattributen.
| Capacitance @ Vr, F | 30pF @ 4V, 1MHz |
|---|---|
| Hersteller | EIC SEMICONDUCTOR INC. |
| Montageart | Through Hole |
| Product Status | Active |
| Technologie | Standard |
| Voltage - DC Reverse (Vr) (Max) | 1000 V |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 920 mV @ 1.5 A |
| Current - Average Rectified (Io) | 1.2A |
| Current - Reverse Leakage @ Vr | 10 µA @ 1000 V |
| Geschwindigkeit | Standard Recovery >500ns, > 200mA (Io) |
| Gehäuse | Bag |
|---|---|
| Package / Case | D-2, Axial |
| Hersteller-Gehäuse | D2 |
| Operating Temperature - Junction | -65°C ~ 175°C |
|---|