Allgemein
| Basis-Teilenummer | CDBDSC8650 |
|---|---|
| Capacitance @ Vr, F | 550pF @ 0V, 1MHz |
| Hersteller | Comchip Technology |
| Montageart | Surface Mount |
| Product Status | Active |
| Reverse Recovery Time (trr) | 0 ns |
| Technologie | SiC (Silicon Carbide) Schottky |

Strukturierte elektrische, mechanische und umweltbezogene Parameter aus importierten Produktattributen.
| Basis-Teilenummer | CDBDSC8650 |
|---|---|
| Capacitance @ Vr, F | 550pF @ 0V, 1MHz |
| Hersteller | Comchip Technology |
| Montageart | Surface Mount |
| Product Status | Active |
| Reverse Recovery Time (trr) | 0 ns |
| Technologie | SiC (Silicon Carbide) Schottky |
| Voltage - DC Reverse (Vr) (Max) | 650 V |
|---|---|
| Voltage - Forward (Vf) (Max) @ If | 1.7 V @ 8 A |
| Current - Average Rectified (Io) | 25.5A |
| Current - Reverse Leakage @ Vr | 100 µA @ 650 V |
| Geschwindigkeit | No Recovery Time > 500mA (Io) |
| Gehäuse | Tube |
|---|---|
| Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Hersteller-Gehäuse | DPAK |
| Operating Temperature - Junction | -55°C ~ 175°C |
|---|