TE0813-01-4BE11-A

Trenz Electronic GmbH

TE0813-01-4BE11-A

Datasheet

Microcontrollers & Embedded

MODULE MPSOC 4GB DDR4

DiscontinuedBoxMicrocontrollers & Embedded

Technical Specifications

Structured electrical, mechanical and environmental parameters from imported product attributes.

General

Connector TypeBoard-to-Board (BTB) Socket
ManufacturerTrenz Electronic GmbH
Module/Board TypeFPGA Core
Product StatusDiscontinued at

Electrical

Core ProcessorXilinx Zynq UltraScale+ XCZU4EG-1SFVC784E
RAM Size2GB
Flash Size128MB

Mechanical

PackageBox
Size / Dimension2.050" L x 2.990" W (52.00mm x 76.00mm)

Environmental

Operating Temperature0°C ~ 85°C