MPXC2011DT1

NXP USA Inc

MPXC2011DT1

Datasheet

Analog & Power

SENSOR 1.45PSID .025V CHIP PAK

Active4-SSIP ModuleAnalog & Power

Technical Specifications

Structured electrical, mechanical and environmental parameters from imported product attributes.

General

Output0 mV ~ 25 mV (10V)
Output TypeWheatstone Bridge
ApplicationsBoard Mount
FeaturesTemperature Compensated
Maximum Pressure10.88PSI (75kPa)
ManufacturerNXP USA Inc.
Mounting TypeThrough Hole
Operating Pressure1.45PSI (10kPa)
Port StyleBarbless
Pressure TypeDifferential
Product StatusActive

Electrical

Supply Voltage3V ~ 10V

Mechanical

PackageTape & Reel (TR) Cut Tape (CT)
Package / Case4-SSIP Module
Termination StylePC Pin

Environmental

Operating Temperature15°C ~ 40°C