Structured electrical, mechanical and environmental parameters from imported product attributes.
| Co-Processors/DSP | Multimedia |
|---|---|
| Display & Interface Controllers | MIPI-CSI, MIPI-DSI |
| Ethernet | 10/100/1000Mbps (1) |
| Graphics Acceleration | Yes |
| Manufacturer | NXP USA Inc. |
| Mounting Type | Surface Mount |
| Product Status | Active |
| Security Features | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS |
| Series | i.MX8D |
| USB | USB 2.0 + PHY (2) |
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M4F |
|---|---|
| Speed | 1.2GHz, 264MHz |
| RAM Controllers | DDR3L, DDR4, LPDDR4 |
| Voltage - I/O | 1.8V, 2.5V, 3.3V |
| Number of Cores/Bus Width | 3 Core, 64-Bit |
| Package | Tape & Reel (TR) |
|---|---|
| Package / Case | 609-BFBGA |
| Supplier Device Package | 609-FBGA (21x21) |
| Operating Temperature | -40°C ~ 125°C (TJ) |
|---|