Structured electrical, mechanical and environmental parameters from imported product attributes.
| Co-Processors/DSP | Multimedia |
|---|---|
| Display & Interface Controllers | LCD, MIPI-CSI |
| Ethernet | GbE |
| Graphics Acceleration | Yes |
| Manufacturer | NXP USA Inc. |
| Mounting Type | Surface Mount |
| Product Status | Active |
| Security Features | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS |
| Series | i.MX8MN |
| USB | USB 2.0 OTG + PHY (1) |
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7 |
|---|---|
| Speed | 1.4GHz |
| RAM Controllers | DDR3L, DDR4, LPDDR4 |
| Number of Cores/Bus Width | 2 Core, 64-Bit |
| Package | Tray |
|---|---|
| Package / Case | 306-TFBGA |
| Supplier Device Package | 306-TFBGA (11x11) |
| Operating Temperature | 0°C~95°C(TJ) |
|---|