General
| Program Memory Type | ROMless |
|---|---|
| Manufacturer | NXP USA Inc. |
| Mounting Type | Surface Mount |
| Oscillator Type | External |
| Product Status | Obsolete |
| Series | HC11 |
Technical Specifications
Structured electrical, mechanical and environmental parameters from imported product attributes.
Electrical
| Core Processor | HC11 |
|---|---|
| Core Size | 8-Bit |
| Speed | 3MHz |
| RAM Size | 256 x 8 |
| Peripherals | POR, WDT |
| Connectivity | SCI, SPI |
| Number of I/O | 38 |
| Voltage - Supply (Vcc/Vdd) | 4.5V ~ 5.5V |
| Data Converters | A/D 8x8b |
Mechanical
| EEPROM Size | 512 x 8 |
|---|---|
| Package | Tape & Reel (TR) |
| Package / Case | 52-LCC (J-Lead) |
Environmental
| Operating Temperature | -40°C~125°C(TA) |
|---|