General
| Program Memory Type | ROMless |
|---|---|
| Manufacturer | NXP USA Inc. |
| Mounting Type | Surface Mount |
| Oscillator Type | External |
| Product Status | Obsolete |
| Series | LPC3100 |
Technical Specifications
Structured electrical, mechanical and environmental parameters from imported product attributes.
Electrical
| Core Processor | ARM9® |
|---|---|
| Core Size | 16/32-Bit |
| Speed | 180MHz |
| RAM Size | 192K x 8 |
| Peripherals | DMA, I²S, LCD, PWM, WDT |
| Connectivity | EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG |
| Number of I/O | 10 |
| Voltage - Supply (Vcc/Vdd) | 1.1V ~ 3.6V |
| Data Converters | A/D 3x10b |
Mechanical
| Package | Tray |
|---|---|
| Package / Case | 208-TFBGA |
Environmental
| Operating Temperature | -40°C~85°C(TA) |
|---|