General
| Program Memory Type | ROMless |
|---|---|
| Manufacturer | NXP USA Inc. |
| Mounting Type | Surface Mount |
| Oscillator Type | Internal |
| Product Status | Active |
| Series | LPC18xx |
Technical Specifications
Structured electrical, mechanical and environmental parameters from imported product attributes.
Electrical
| Core Processor | ARM® Cortex®-M3 |
|---|---|
| Core Size | 32-Bit Single-Core |
| Speed | 180MHz |
| RAM Size | 200K x 8 |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG |
| Number of I/O | 49 |
| Voltage - Supply (Vcc/Vdd) | 2.2V ~ 3.6V |
| Data Converters | A/D 8x10b |
Mechanical
| Package | Tape & Reel (TR) |
|---|---|
| Package / Case | 100-TFBGA |
Environmental
| Operating Temperature | -40°C~85°C(TA) |
|---|